G.Skill has announced new DDR5-6400 CL30 RAM kits that combine high memory capacities with fast speeds and low latency to compete with the best RAM. The kits, launched under the Trident Z5 RGB and Trident Z5 Royal series, will feature 96GB (2x48GB) capacities, with smaller 64GB and 48GB variants also in the works. The DRAM manufacturer promises DDR5-6400 CL30 specs using Intel XMP 3.0 and has also showcased how the memory performs on an equivalent AMD Ryzen 9000 system.

New e-mails from Huawei engineers regarding Linux kernel development suggest that HiSilicon – Huawei’s chip subsidiary – is prepping a new Kunpeng SoC with HBM (High Bandwidth Memory) technology – as highlighted by Phoronix. This will likely be the the first significant release from HiSilicon in a while but don’t get your hopes up as it could also just be a rebranded older model with a slight pinch of HBM.

Some purported specifications of Intel’s upcoming Core Ultra 200U or Arrow Lake-U mobile processors have been surfaced by Jaykihn at X. It turns out that despite the “Ultra” moniker; the Core Ultra 200U CPUs will utilize an updated version of the Meteor Lake architecture – reportedly using the Intel 3 node.

TeamGroup has introduced its family of clock-unbuffered memory modules (CUDIMMs) that promise to significantly enhance memory performance on Intel’s latest Core Ultra 200S-series platforms. TeamGroup’s flagship T-Force Xtreem CKD DDR5 modules boast a data transfer of DDR5-9000 and overclocking potential up to DDR5-9600.

Golden Pig Upgrade Pack, a well-known leaker, has published preliminary details about the potential configurations of AMD’s Ryzen AI Max 300 (codenamed Strix Halo) processors, which are expected to be released in early 2025. In addition, the leaker revealed the official name of these CPUs with an ultra-high-end integrated Radeon GPU.

Hardware leakers Jaykihn and Harukaze5719 have reportedly leaked the power profiles for Intel’s Arrow Lake and Panther Lake processors. These next-generation chips will arrive to rival the best CPUs on the market. The leak details Intel’s Baseline, Performance, and Extreme power profiles for five distinct variants of Arrow Lake-S processors. The core configurations and TDPs include: 8+16 at 125W, 8+12 at 125W, 6+8 at 125W, 6+8 at 65W, and 6+4 at 65W. The former number depicts the number of P-cores, while the latter depicts the chip’s number of E-cores.

Yesterday, Sabrent gave the world a sneak peek of the world’s first Thunderbolt 5 external SSD, using and benchmarking a prototype unit to establish baseline expectations for the next generation of external storage. The reveal from Sabrent comes just under a year after the official Thunderbolt 5 debut, which provided specs of a maximum 80 Gigabits bidirectional throughput (roughly 10 GB/s read/write theoretical maximum).

A purported AMD Ryzen 9 9900X Geekbench 6 CPU test run has been surfaced by Benchleaks. The single-threaded score of 3,401 points is remarkable and, if genuine, would go straight to the top of the Geekbench 6 processor benchmark charts. A reported multi-threaded...

Asus has announced a new entry in its Z790 motherboard lineup, the Z790-AYW WIFI W. Designed for 14th-generation Raptor Lake Refresh processors and older, the new ATX form factor mainboard supports overclocking that might rival MSI’s MPower lineup. Asus has a...

Samsung is pushing hard to develop 3D DRAM, the future of compact RAM, according to its presentation at IMW 2024. VCT (vertical channel transistor) DRAM is the first mountain to climb in this goal, and Samsung is scheduled to complete initial development on it next...